US 12,302,677 B2
Semiconductor device and method
Chen-Hua Yu, Hsinchu (TW); Keng-Han Lin, Hsinchu (TW); Hung-Jui Kuo, Hsinchu (TW); and Hui-Jung Tsai, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Dec. 1, 2023, as Appl. No. 18/526,155.
Application 17/509,262 is a division of application No. 16/158,604, filed on Oct. 12, 2018, granted, now 11,158,775, issued on Oct. 26, 2021.
Application 18/526,155 is a continuation of application No. 17/509,262, filed on Oct. 25, 2021, granted, now 11,855,246.
Claims priority of provisional application 62/682,469, filed on Jun. 8, 2018.
Prior Publication US 2024/0105901 A1, Mar. 28, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/522 (2006.01); H01L 25/075 (2006.01); H10H 20/80 (2025.01); H10H 20/814 (2025.01); H10H 20/852 (2025.01); H10H 20/857 (2025.01); H01S 5/022 (2021.01); H10H 20/01 (2025.01)
CPC H10H 20/857 (2025.01) [H01L 23/5226 (2013.01); H01L 25/0753 (2013.01); H10H 20/8142 (2025.01); H10H 20/852 (2025.01); H10H 20/862 (2025.01); H01S 5/022 (2013.01); H10H 20/034 (2025.01); H10H 20/036 (2025.01); H10H 20/0362 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
encapsulating a light emitting diode with a photosensitive encapsulant;
forming a first opening through the photosensitive encapsulant by:
exposing the photosensitive encapsulant to light having a first pattern corresponding to the first opening; and
developing the photosensitive encapsulant; forming a second opening through the photosensitive encapsulant by:
forming a mask layer over the photosensitive encapsulant;
patterning the mask layer with a second pattern corresponding to the second opening, wherein the second opening is smaller than the first opening; and
transferring the second pattern from the mask layer to the photosensitive encapsulant; and
forming a first conductive via and a second conductive via in the first opening and the second opening, respectively.