| CPC H10H 20/857 (2025.01) [H10H 20/01 (2025.01)] | 8 Claims |

|
1. A method of joining a pin member of a first component to a second component via an adhesive, where the second component has a cavity, to fasten the pin in a target position extending at least partially into the cavity with a distance (D) between a bottom surface of the cavity and a facing end of the pin, the method comprising the steps of:
positioning the pin in the target position;
determining the distance (D) between the bottom surface of the cavity and the facing end of the pin in the target position;
removing the pin from the cavity;
applying a rigid spacer on the bottom surface of the cavity, wherein a thickness of the rigid spacer equals the distance (D) between the bottom surface of the cavity and the facing end of the pin in the target position;
filling the adhesive into the cavity onto the rigid spacer,
repositioning the pin at the target position; and
curing the adhesive to obtain a joint between the pin and the second component.
|