US 12,302,657 B2
Semiconductor device and method of forming an optical semiconductor package with a shield structure
Emmanuel Espiritu, Singapore (SG); Il Kwon Shim, Singapore (SG); Jeffrey Punzalan, Singapore (SG); and Teddy Joaquin Carreon, Singapore (SG)
Assigned to UTAC Headquarters Pte. Ltd., Singapore (SG)
Filed by UTAC Headquarters Pte. Ltd., Singapore (SG)
Filed on May 23, 2022, as Appl. No. 17/664,510.
Claims priority of provisional application 63/194,375, filed on May 28, 2021.
Prior Publication US 2022/0384505 A1, Dec. 1, 2022
Int. Cl. H01L 27/146 (2006.01); H01L 23/31 (2006.01); H10F 39/00 (2025.01)
CPC H10F 39/8057 (2025.01) [H01L 23/3157 (2013.01); H10F 39/011 (2025.01); H10F 39/804 (2025.01); H10F 39/8063 (2025.01); H10F 39/811 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate;
a semiconductor die including a photosensitive circuit disposed over the substrate;
a shield disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit, wherein the shield includes a peak, an inner section oriented toward the semiconductor die relative to the peak, and an outer section oriented away from the semiconductor die relative to the peak, and wherein the outer section of the shield is attached to the substrate and includes a second opening formed through a sloped portion of the outer section;
a bead of adhesive extending around the photosensitive circuit between the shield and semiconductor die; and
an encapsulant deposited over the substrate and semiconductor die, wherein the encapsulant extends into the second opening and a first area between the shield and substrate while the bead of adhesive seals a gap between the shield and semiconductor die so that a second area over the photosensitive circuit remains devoid of the encapsulant.