US 12,302,575 B2
Memory device
Kyongsik Yeom, Suwon-si (KR); Changmin Jeon, Yongin-si (KR); and Yongkyu Lee, Gwacheon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 21, 2022, as Appl. No. 17/725,993.
Claims priority of application No. 10-2021-0101253 (KR), filed on Aug. 2, 2021.
Prior Publication US 2023/0035568 A1, Feb. 2, 2023
Int. Cl. H01L 23/535 (2006.01); H01L 27/11582 (2017.01); H10B 43/35 (2023.01)
CPC H10B 43/35 (2023.02) 20 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a first bit line configured to supply a first bit line bias voltage;
a memory cell transistor having a first operating voltage;
a selection transistor having a second operating voltage, and configured to control the supply of the first bit line bias voltage to a source of the memory cell transistor,
wherein a drain of the selection transistor is connected to the first bit line; and
a second bit line connected to a drain of the memory cell transistor,
wherein a level of the first operating voltage is about equal to a level of the second operating voltage.