US 12,302,509 B2
Power routing module with ports
David S. Armacost, Leawood, KS (US); and Cory D. Adams, Raymore, MO (US)
Assigned to Peterson Manufacturing Company, Grandview, MO (US)
Filed by Peterson Manufacturing Company, Grandview, MO (US)
Filed on Dec. 6, 2023, as Appl. No. 18/530,615.
Application 18/530,615 is a continuation of application No. 17/077,637, filed on Oct. 22, 2020, granted, now 11,889,639.
Prior Publication US 2024/0114635 A1, Apr. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. F21V 23/06 (2006.01); H01R 25/00 (2006.01); H01R 27/02 (2006.01); H05K 5/00 (2025.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01); H01R 13/52 (2006.01); H01R 13/627 (2006.01); H01R 13/73 (2006.01)
CPC H05K 5/0069 (2013.01) [F21V 23/06 (2013.01); H01R 25/006 (2013.01); H01R 27/02 (2013.01); H05K 5/0217 (2013.01); H05K 5/0247 (2013.01); H05K 5/0252 (2013.01); H05K 5/03 (2013.01); H01R 13/5213 (2013.01); H01R 13/6272 (2013.01); H01R 13/73 (2013.01); H01R 2201/26 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A circuit board cover comprising:
a housing having a first surface and a perimeter edge defined around a periphery of the first surface;
a skirt extending from the perimeter edge between the first surface and a lower abutment surface, the lower abutment surface operable to form a seal with a portion of a vehicle body;
a housing cavity at least partially defined by the first surface, the perimeter edge, and the skirt, the housing cavity operable to house a printed circuit board;
a shoulder disposed circumferentially around the first surface, the shoulder operable to allow the skirt to flex; and
at least one port disposed on the first surface.