US 12,302,507 B2
Circuit board structure for display device
Chi-Sheng Liao, Hsin-Chu (TW); Bo-Ru Jian, Hsin-Chu (TW); Bin-Cheng Lin, Hsin-Chu (TW); and Ta-Wen Liao, Hsin-Chu (TW)
Assigned to AUO CORPORATION, Hsin-Chu (TW)
Filed by AUO Corporation, Hsin-Chu (TW)
Filed on Feb. 15, 2023, as Appl. No. 18/169,724.
Claims priority of provisional application 63/313,744, filed on Feb. 25, 2022.
Claims priority of application No. 111128198 (TW), filed on Jul. 27, 2022.
Prior Publication US 2023/0276580 A1, Aug. 31, 2023
Int. Cl. H05K 1/02 (2006.01); H01L 21/4763 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 23/485 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01); H05K 1/03 (2006.01); H05K 3/28 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01)
CPC H05K 3/4679 (2013.01) [H05K 1/036 (2013.01); H05K 3/282 (2013.01); H05K 3/4007 (2013.01); H05K 3/4046 (2013.01); H05K 2201/10128 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A circuit board structure for a display device, comprising:
a substrate comprising a first surface and a second surface opposite to the first surface;
a bump disposed on the first surface of the substrate, wherein the bump comprises a first inorganic material;
a protective layer disposed on the first surface of the substrate, wherein the protective layer comprises an organic material and a first opening, and wherein the bump is positioned in the first opening; and
a moisture-resistant layer covering sidewalls of the protective layer in the first opening and an upper surface of the protective layer, wherein the moisture-resistant layer comprise a second inorganic material and a second opening, and wherein a portion of the bump is exposed in the second opening.