US 12,302,505 B2
Thin film-based microfluidic electronic device, method of forming thereof, and skin and tissue adhesive applications
Kento Yamagishi, Evanston, IL (US); Tsz Him Ching, Singapore (SG); Michinao Hashimoto, Singapore (SG); and Hiroto Koshika, Tokyo (JP)
Assigned to Singapore University Of Technology And Design, Singapore (SG)
Appl. No. 17/784,135
Filed by Singapore University Of Technology And Design, Singapore (SG)
PCT Filed Dec. 10, 2020, PCT No. PCT/SG2020/050738
§ 371(c)(1), (2) Date Jun. 10, 2022,
PCT Pub. No. WO2021/118468, PCT Pub. Date Jun. 17, 2021.
Claims priority of application No. 10 2019 11935P (SG), filed on Dec. 10, 2019.
Prior Publication US 2023/0031505 A1, Feb. 2, 2023
Int. Cl. H05K 3/10 (2006.01); A61B 5/00 (2006.01); B01L 3/00 (2006.01); H04R 1/10 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01)
CPC H05K 3/107 (2013.01) [A61B 5/6833 (2013.01); B01L 3/502715 (2013.01); H05K 1/0283 (2013.01); H05K 1/092 (2013.01); H05K 1/182 (2013.01); H05K 3/30 (2013.01); A61B 2562/12 (2013.01); A61B 2562/164 (2013.01); A61B 2562/168 (2013.01); B01L 2300/0636 (2013.01); B01L 2300/0883 (2013.01); B01L 2300/123 (2013.01); H04R 1/1091 (2013.01); H04R 2460/13 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of forming a thin film-based microfluidic electronic device, the method comprising:
providing a first elastomeric thin film layer on a substrate;
depositing a first elastomer on the first elastomeric thin film layer by direct ink writing to form an elastomeric structure configured to define a microfluidic channel on the first elastomeric thin film layer;
providing a second elastomeric thin film layer over the elastomeric structure to cover the microfluidic channel;
providing a sacrificial layer on the second elastomeric thin film layer;
depositing liquid metal into the microfluidic channel to form a conductor in the microfluidic channel covered by the second elastomeric thin film layer which is supported by the sacrificial layer; and
electrically connecting the conductor to an electronic component and removing the sacrificial layer to form the thin film-based microfluidic electronic device.