US 12,302,502 B2
Electronic component package
Tomofumi Kobayashi, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Mar. 7, 2023, as Appl. No. 18/118,178.
Claims priority of application No. 2022-037392 (JP), filed on Mar. 10, 2022.
Prior Publication US 2023/0320052 A1, Oct. 5, 2023
Int. Cl. H05K 13/00 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H05K 13/0084 (2013.01) [H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic component package comprising:
a base tape including a plurality of recesses; wherein
on an inner surface of each recess of the plurality of recesses, a protrusion that abuts an electronic component inside of the recess is provided;
the inner surface includes a sidewall and a bottom surface that intersect with each other;
the entire protrusion is spaced away from the intersection of the sidewall and the bottom surface;
the recess includes an opening;
the protrusion is provided on the sidewall and extends from the opening on the sidewall; and
the electronic component includes a multilayer body having a parallelepiped or substantially parallelepiped shape and an external electrode on each of two end surfaces of the multilayer body.