US 12,302,500 B2
Power conversion device including substrates with connectors
Naoya Abe, Tokyo (JP); Kenta Fujii, Tokyo (JP); Yoshihiro Takeshima, Tokyo (JP); Satoshi Ishibashi, Tokyo (JP); Yujiro Nakada, Tokyo (JP); and Yukiko Nakanishi, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Oct. 19, 2022, as Appl. No. 17/969,285.
Claims priority of application No. 2021-175336 (JP), filed on Oct. 27, 2021.
Prior Publication US 2023/0130570 A1, Apr. 27, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 1/14 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10272 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A power conversion device, comprising:
a power module installing member;
a power module provided on the power module installing member;
a bus bar assembly provided on the power module installing member;
a first substrate provided on the bus bar assembly; and
a second substrate provided on one of the power module installing member or the bus bar assembly,
wherein the power module is arranged between the power module installing member and the bus bar assembly,
wherein the first substrate includes a first printed wiring board arranged between the power module and the bus bar assembly, and a first connector and a second connector which are each provided on the first printed wiring board,
wherein the second substrate includes a second printed wiring board and a third connector provided on the second printed wiring board,
wherein the bus bar assembly is arranged between the first printed wiring board and the second printed wiring board,
wherein the first connector penetrates through the first printed wiring board and is directly connected to a signal terminal of the power module and does not overlap with the bus bar assembly in a direction normal to a surface of the first substrate, and
wherein the second connector and the third connector are connected to each other.