US 12,302,497 B2
Densely packed electronic systems
Peter C. Salmon, Mountain View, CA (US)
Filed by Peter C. Salmon, Mountain View, CA (US)
Filed on Nov. 17, 2022, as Appl. No. 17/989,549.
Application 17/989,549 is a continuation of application No. 17/685,322, filed on Mar. 2, 2022, granted, now 11,546,991.
Application 17/685,322 is a continuation in part of application No. 17/370,737, filed on Jul. 8, 2021, granted, now 11,393,807, issued on Jul. 19, 2022.
Application 17/370,737 is a continuation in part of application No. 16/816,173, filed on Mar. 11, 2020, granted, now 10,966,338, issued on Mar. 30, 2021.
Claims priority of provisional application 63/135,990, filed on Jan. 11, 2021.
Claims priority of provisional application 63/164,437, filed on Mar. 22, 2021.
Claims priority of provisional application 63/159,212, filed on Mar. 10, 2021.
Prior Publication US 2023/0088049 A1, Mar. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 1/32 (2019.01); G06F 1/18 (2006.01); G06F 1/3287 (2019.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H05K 1/14 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/141 (2013.01) [G06F 1/189 (2013.01); G06F 1/3287 (2013.01); H01L 23/3128 (2013.01); H01L 23/3677 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 25/0652 (2013.01); H05K 7/20772 (2013.01); H05K 2201/10522 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A reconfigurable electronic assembly comprising:
a substrate;
a plurality of components flip chip mounted on a first side and a second side of the substrate;
wherein the plurality of components are organized into a plurality of independently operable clusters on each of the first side and the second side, each independently operable cluster comprising a plurality of logic components and a plurality of memory components and at least one power distribution chip;
wherein, within each independently operable cluster at least one of the plurality of logic components is a functionally redundant component and at least one of the plurality of memory components is a functionally redundant component.