US 12,302,496 B2
System and method to eliminate via striping
Sandor Farkas, Round Rock, TX (US); and Bhyrav Mutnury, Austin, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by DELL PRODUCTS L.P., Round Rock, TX (US)
Filed on Sep. 1, 2022, as Appl. No. 17/901,093.
Prior Publication US 2024/0080978 A1, Mar. 7, 2024
Int. Cl. H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 3/0047 (2013.01); H05K 3/4038 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/0207 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a plurality of metal layers;
a metalized circuit via interconnecting a first one of the metal layers and a second one of the metal layers; and
a back-drill hole drilled to remove metallization of the metallized circuit via from a third metal layer adjacent to the second metal layer to a fourth metal layer at a first surface of the printed circuit board, wherein the back-drill hole has a profile that includes an undercut directly below the metallized circuit via.