US 12,302,495 B2
Interposer structure and an electronic device including the same
Yeonkyung Chung, Suwon-si (KR); Jichul Kim, Suwon-si (KR); Jinyong Park, Suwon-si (KR); and Gyeongmin Jin, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 31, 2022, as Appl. No. 17/900,687.
Application 17/900,687 is a continuation of application No. PCT/KR2021/014133, filed on Oct. 13, 2021.
Claims priority of application No. 10-2020-0132005 (KR), filed on Oct. 13, 2020.
Prior Publication US 2022/0418108 A1, Dec. 29, 2022
Int. Cl. H05K 1/11 (2006.01); H04M 1/02 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/115 (2013.01) [H04M 1/0277 (2013.01); H05K 1/0204 (2013.01); H05K 1/111 (2013.01); H05K 3/3457 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first printed circuit board (PCB);
a second PCB having a shape corresponding to the first PCB; and
an interposer surrounding a space between the first PCB and the second PCB and comprising multiple pads,
wherein the interposer comprises:
a first surface in contact with the first PCB,
a second surface in contact with the second PCB,
a first lateral surface facing the space,
a second lateral surface opposite to the first lateral surface,
a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect a first point and a second point, wherein a first end portion of the heat conduction pattern is connected to the first point on a first edge portion between the first surface and the second lateral surface, and wherein a second end portion of the heat conduction pattern is connected to the second point on a second edge portion between the first surface and the first lateral surface;
a first lateral conductive part disposed on the second lateral surface and extended from the first end portion of the heat conduction pattern; and
a second lateral conductive part disposed on the first lateral surface and extended from the second end portion of the heat conduction pattern.