US 12,302,051 B2
Low profile acoustic module
Daniel Ryan Marquez, Vancouver, WA (US); WeiJen Cheng, Zhubei (TW); and Hungl Wu, New Taipei (TW)
Assigned to Logitech Europe S.A., Lausanne (CH)
Filed by Logitech Europe S.A., Lausanne (CH)
Filed on Apr. 26, 2023, as Appl. No. 18/139,877.
Prior Publication US 2024/0365039 A1, Oct. 31, 2024
Int. Cl. H04R 1/10 (2006.01)
CPC H04R 1/1008 (2013.01) [H04R 1/1058 (2013.01)] 33 Claims
OG exemplary drawing
 
1. A headset, comprising:
a pair of speakers;
a pair of headset acoustic modules, each headset acoustic module comprising:
a first chamber comprising a side wall and a first portion of a back wall and defining a first volume, wherein the side wall defines an opening that is configured to retain one of the pair of speakers; and
a second chamber comprising the side wall, a front wall, and a second portion of the back wall and defining a second volume greater than the first volume, wherein the second volume is fluidly coupled to the first volume via a first set of one or more vents on the side wall, the second volume is fluidly coupled to an ambient atmosphere via a second set of one or more vents, wherein the second chamber at least partially surrounds and is concentric with the first chamber, and wherein the sidewall extends from the back wall to the front wall; and
a headband coupling a first headset acoustic module of the pair of headset acoustic modules to a second headset acoustic module of the pair of headset acoustic modules.