US 12,302,049 B2
Electronic device comprising microphone module
Jeong Woo, Suwon-si (KR); Minsik Lim, Suwon-si (KR); and Jungchul An, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 6, 2023, as Appl. No. 18/106,283.
Application 18/106,283 is a continuation of application No. PCT/KR2021/009919, filed on Jul. 29, 2021.
Claims priority of application No. 10-2020-0097654 (KR), filed on Aug. 4, 2020.
Prior Publication US 2023/0188879 A1, Jun. 15, 2023
Int. Cl. H04R 1/04 (2006.01); H04M 1/02 (2006.01); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04R 1/02 (2006.01); H04R 1/08 (2006.01); H04R 3/00 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01)
CPC H04R 1/04 (2013.01) [H04M 1/0264 (2013.01); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04R 1/028 (2013.01); H04R 1/086 (2013.01); H04R 3/00 (2013.01); H05K 1/18 (2013.01); H05K 7/1427 (2013.01); H04R 2499/11 (2013.01); H04R 2499/15 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10121 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing;
a camera cover member, at least a portion of which is disposed in the housing, the camera cover member comprising a first through-hole in fluid communication with the outside of the housing, wherein the camera cover member is configured to support at least a portion of a camera module disposed in the housing;
a microphone module disposed in the housing so as to be adjacent to the camera module, the microphone module comprising a first circuit board disposed on the camera cover member, and a microphone disposed on the first circuit board; and
a second circuit board disposed to face the camera cover member with the microphone module therebetween, the second circuit board comprising a contact structure configured to make contact with at least a portion of the first circuit board,
wherein the contact structure is configured to electrically connect the first circuit board and the second circuit board and disposed to surround at least a portion of the microphone between a surface of the first circuit board and a surface of the second circuit board.