US 12,302,043 B2
System and device with laser array illumination
Siyang Cheng, Xiamen (CN); Jiansheng Wu, Xiamen (CN); Peijin Wang, Xiamen (CN); and Zirong Zeng, Xiamen (CN)
Assigned to GUANGYI (XIAMEN) TECHNOLOGY CO., LTD., Xiamen (CN)
Filed by Guangyi (Xiamen) Technology Co., Ltd., Xiamen (CN)
Filed on Jun. 24, 2021, as Appl. No. 17/357,844.
Application 17/357,844 is a continuation of application No. PCT/CN2019/128272, filed on Dec. 25, 2019.
Claims priority of application No. 201822229316.4 (CN), filed on Dec. 26, 2018.
Prior Publication US 2022/0021180 A1, Jan. 20, 2022
Int. Cl. H01S 5/024 (2006.01); F21V 29/51 (2015.01); F21V 29/58 (2015.01); H01S 5/02253 (2021.01); H01S 5/023 (2021.01); H01S 5/40 (2006.01); H04N 9/31 (2006.01); H05K 7/20 (2006.01); F21Y 105/10 (2016.01); F21Y 115/30 (2016.01)
CPC H04N 9/3161 (2013.01) [F21V 29/51 (2015.01); F21V 29/58 (2015.01); H01S 5/02253 (2021.01); H01S 5/023 (2021.01); H01S 5/02423 (2013.01); H01S 5/02469 (2013.01); H01S 5/4025 (2013.01); H05K 7/20336 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/30 (2016.08)] 19 Claims
OG exemplary drawing
 
18. A diode laser array module, comprising:
a first plurality of diode laser modules, wherein:
each diode laser module of the first plurality of diode laser modules has a respective module body having a top surface, a bottom surface, a first side surface, and a second side surface,
the respective module body of said each diode laser module includes a respective plurality of first holes in the top surface of the respective module body, and
said each diode laser module includes a respective plurality of diode lasers mounted at least partially within the respective plurality of first holes of the respective module body of said each diode laser module, with respective pins of the respective plurality of diode lasers extending downward out of the respective plurality of first holes;
a first plurality of pin connector modules, wherein each respective pin connector module is configured to connect the respective pins of the respective plurality of diode lasers of at least one of the first plurality of diode laser modules to a driving circuit module that is disposed at a location separate from the bottom surface of the module body of said at least one diode laser module; and
a cooling module, wherein the cooling module includes a heat conducting body defined by a top surface, a bottom surface, and at least a first side surface and a second side surface of the cooling module, and includes a cooling structure that is at least partially embedded in the heat conducting body of the cooling module, wherein:
the top surface of the heat conducting body of the cooling module is in thermal contact with the bottom surfaces of the plurality of diode laser modules, and
at least one of the bottom surface of the module body of the respective diode laser module or the top surface of the heat conducting body of the cooling module includes one or more recessed areas at locations corresponding to the respective plurality of first holes of the respective module body of the respective diode laser module, such that one or more channels are formed by the one or more recessed areas when the top surface of the heat conducting body of the cooling module is in thermal contact with the bottom surfaces of the respective module bodies of the plurality of diode laser modules,
each pin connector module includes a respective first conductive portion that is located within the one or more channels formed between the top surface of the body of the cooling module and the bottom surfaces of the respective plurality of diode laser modules and electrically connects the respective plurality of diode lasers that are inserted into the respective plurality of first holes of a respective diode laser module, and
each pin connector module includes a respective second conductive portion that extends out of the channel formed between the top surface of the body of the cooling module and the bottom surfaces of the plurality of diode laser modules to a location where electrical connections to the driving circuit module are to be made.