US 12,302,008 B2
Image sensor module and method of operating the same
Kyoungyoung Kim, Suwon-si (KR); Sangsoo Ko, Yongin-si (KR); Byeoungsu Kim, Hwaseong-si (KR); and Sanghyuck Ha, Yongin-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Apr. 22, 2022, as Appl. No. 17/727,055.
Claims priority of application No. 10-2021-0053166 (KR), filed on Apr. 23, 2021.
Prior Publication US 2022/0345624 A1, Oct. 27, 2022
Int. Cl. H04N 23/80 (2023.01); G06T 1/20 (2006.01); G06T 1/60 (2006.01); G06T 7/11 (2017.01); G06T 7/12 (2017.01); H04N 1/21 (2006.01); H04N 23/60 (2023.01)
CPC H04N 23/80 (2023.01) [G06T 1/20 (2013.01); G06T 1/60 (2013.01); G06T 7/11 (2017.01); G06T 7/12 (2017.01); H04N 1/2129 (2013.01); H04N 23/665 (2023.01); G06T 2207/20021 (2013.01); G06T 2207/20084 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An image sensor module comprising:
an image sensor configured to generate image data;
a memory including a processor in memory (PIM) circuit and banks configured to store the image data, the PIM circuit including a plurality of processing elements; and
a signal processor,
wherein the memory is configured to
read the image data from the banks,
perform a first image processing operation on the image data by using the processing elements corresponding to the banks, and
store image-processed image data on which the first image processing operation is performed in the banks or output the image-processed image data,
wherein at least some of the plurality of processing elements are connected through a data line.