US 12,301,210 B2
Method of making stacked acoustic wave resonator package with laser-drilled vias
Atsushi Takano, Kadoma (JP); Mitsuhiro Furukawa, Nishinomiya (JP); and Takeshi Furusawa, Toyonaka (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Dec. 28, 2020, as Appl. No. 17/135,567.
Application 17/135,567 is a continuation of application No. 17/034,810, filed on Sep. 28, 2020, granted, now 11,581,870.
Claims priority of provisional application 62/907,255, filed on Sep. 27, 2019.
Claims priority of provisional application 62/907,264, filed on Sep. 27, 2019.
Claims priority of provisional application 62/907,290, filed on Sep. 27, 2019.
Claims priority of provisional application 62/907,329, filed on Sep. 27, 2019.
Prior Publication US 2021/0152151 A1, May 20, 2021
Int. Cl. H03H 9/25 (2006.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/25 (2013.01) [H03H 3/08 (2013.01); H03H 9/02574 (2013.01); H03H 9/145 (2013.01); H03H 9/6406 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of fabricating a packaged acoustic wave component, the method comprising:
providing a first acoustic wave resonator including a first interdigital transducer electrode on a first piezoelectric layer having a first thickness, the first piezoelectric layer supporting a first stopper structure that is in electrical communication with the first interdigital transducer electrode, the first stopper structure including a first aluminum layer that underlies a portion of the first interdigital transducer electrode, the first piezoelectric layer further supporting a second stopper structure that is thicker than the first stopper structure, the second stopper structure having a second aluminum layer, a copper layer and a tin layer;
providing a second acoustic wave resonator including a second interdigital transducer electrode on a second piezoelectric layer having a second thickness that is greater than the first thickness of the first piezoelectric layer, the second stopper structure in electrical communication with the second interdigital transducer electrode;
bonding the first piezoelectric layer to the second piezoelectric layer to form a package structure encapsulating the first and second interdigital transducer electrodes including bonding the tin layer of the second stopper structure to an interconnect pad supported by the second piezoelectric layer; and
forming at least a first via by applying laser light to an outside surface of the first piezoelectric layer opposite the second stopper structure thereby removing at least a portion of the first piezoelectric layer to expose a portion of the second stopper structure, the first via extending through the first piezoelectric layer and partially through the second aluminum layer.