US 12,301,127 B2
Semiconductor module
Akito Nakagome, Matsumoto (JP); Ryoichi Kato, Matsumoto (JP); and Yuma Murata, Matsumoto (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on Apr. 28, 2022, as Appl. No. 17/731,456.
Claims priority of application No. 2021-100040 (JP), filed on Jun. 16, 2021.
Prior Publication US 2022/0407432 A1, Dec. 22, 2022
Int. Cl. H02M 7/00 (2006.01); H01L 23/498 (2006.01)
CPC H02M 7/003 (2013.01) [H01L 23/49838 (2013.01); H01L 23/49894 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a first power supply terminal connected to a first polarity side of direct current power;
a second power supply terminal disposed above the first power supply terminal and connected to a second polarity side of the direct current power in a state where a part of the first power supply terminal including one end of the first power supply terminal is exposed;
an insulating sheet disposed between the first power supply terminal and the second power supply terminal for insulation between the first power supply terminal and the second power supply terminal in a state where a part of the insulating sheet is exposed between the one end of the first power supply terminal and one end of the second power supply terminal; and
a first dielectric portion formed to cover at least a corner of the one end of the second power supply terminal, the corner being in contact with the insulating sheet.