US 12,300,592 B2
Fan-out package with controllable standoff
Po-Hao Tsai, Taoyuan (TW); Techi Wong, Zhubei (TW); Meng-Wei Chou, Zhubei (TW); Meng-Liang Lin, Hsinchu (TW); Po-Yao Chuang, Hsinchu (TW); and Shin-Puu Jeng, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 13, 2023, as Appl. No. 18/351,809.
Application 17/383,953 is a division of application No. 16/118,538, filed on Aug. 31, 2018, granted, now 11,075,151, issued on Jul. 27, 2021.
Application 18/351,809 is a continuation of application No. 17/383,953, filed on Jul. 23, 2021, granted, now 11,854,955.
Claims priority of provisional application 62/692,027, filed on Jun. 29, 2018.
Prior Publication US 2023/0361015 A1, Nov. 9, 2023
Int. Cl. H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 21/486 (2013.01); H01L 24/09 (2013.01); H01L 2224/02379 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a conductive pillar having a first surface, a second surface, and a sidewall surface extending between the first surface and the second surface, the sidewall surface comprising:
a first part; and
a second part connected to the first part;
a device die;
a barrier layer in contact with the first part of the sidewall surface of the conductive pillar, wherein the barrier layer comprises a planar top surface comprising a first portion directly over and overlapping the device die, and a second portion vertically misaligned from the device die, and wherein the first part of the sidewall surface extends to the planar top surface of the barrier layer;
an encapsulant in contact with the second part of the sidewall surface of the conductive pillar, wherein the device die is further in the encapsulant; and
a reflowable conductive material on the first surface of the conductive pillar, wherein the reflowable conductive material is in the encapsulant.