US 12,300,567 B2
Solid metal foam thermal interface material
Ross B. Berntson, New Hartford, NY (US); and David P. Socha, Whitesboro, NY (US)
Assigned to INDIUM CORPORATION, Utica, NY (US)
Filed by INDIUM CORPORATION, Utica, NY (US)
Filed on May 18, 2022, as Appl. No. 17/747,923.
Claims priority of provisional application 63/190,586, filed on May 19, 2021.
Prior Publication US 2022/0375816 A1, Nov. 24, 2022
Int. Cl. H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); G01R 31/28 (2006.01); H01L 23/42 (2006.01)
CPC H01L 23/3733 (2013.01) [H01L 21/4882 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 24/29 (2013.01); G01R 31/2874 (2013.01); H01L 23/42 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29205 (2013.01); H01L 2224/29209 (2013.01); H01L 2224/29305 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32502 (2013.01); H01L 2224/32506 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83805 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/0134 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/16598 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor assembly, comprising:
a heat generating device;
a heat transferring device; and
a solid alloy bonding the heat generating device to the heat transferring device, wherein the solid alloy is formed by:
applying a thermal interface material (TIM) between the heat generating device and the heat transferring device such that a first surface of the TIM is in touching relation with a surface of the heat generating device, and a second surface of the TIM opposite the first surface is in touching relation with a surface of the heat transferring device, wherein:
the TIM comprises a solid metal foam and a first liquid metal;
the solid metal foam comprises one or more interstitial porous areas extending from a first surface of the solid metal foam through a second surface of the solid metal foam opposite the first surface of the solid metal foam; and
the TIM is applied by placing the solid metal foam such that a first surface of the solid metal foam is in touching relation with the surface of the heat generating device, and applying the first liquid metal on the first surface of the solid metal foam such that a portion of the first liquid metal diffuses through the one or more interstitial porous areas and onto the surface of the heat generating device; and
compressing the TIM to form the solid alloy from the TIM.