CPC H01L 21/67144 (2013.01) [H01L 21/6835 (2013.01); H01L 25/18 (2013.01); H01L 27/14634 (2013.01); H01L 27/1469 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/08145 (2013.01)] | 12 Claims |
1. A method of protecting optoelectronic devices against electrostatic discharges, each optoelectronic device comprising an optoelectronic circuit comprising at least one optoelectronic component from among a light-emitting diode or a photodiode, the method comprising forming a first wafer, comprising a plurality of copies of the optoelectronic circuit, bonding the first wafer to a support, separating the optoelectronic devices from one another, and removing from the support a plurality of optoelectronic devices among said optoelectronic devices by means of a gripping system, wherein the gripping system comprises at least one protection system for protecting optoelectronic devices against electrostatic discharges, wherein before the step of removal of said plurality of optoelectronic devices from the support by the gripping system, one of the optoelectronic devices other than said plurality of optoelectronic devices, called sacrificial device, is placed into contact with the gripping system before said plurality of optoelectronic devices comes into contact with the gripping system.
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