US 12,300,511 B1
Fabrication method for package structure
Xianming Chen, Guangdong (CN); Yuanming Chen, Guangdong (CN); Lei Feng, Guangdong (CN); Benxia Huang, Guangdong (CN); Yongzhi Zeng, Guangdong (CN); Wei He, Guangdong (CN); and Yanlin Dong, Guangdong (CN)
Assigned to University of Electronic Science and Technology of China, Sichuan (CN); and Zhuhai YUEXIN Semiconductor Limited Liability Company, Guangdong (CN)
Filed by University of Electronic Science and Technology of China, Sichuan (CN); and Zhuhai YUEXIN Semiconductor Limited Liability Company, Guangdong (CN)
Filed on Jan. 15, 2025, as Appl. No. 19/021,887.
Claims priority of application No. 202411783224.4 (CN), filed on Dec. 5, 2024.
Int. Cl. H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/4853 (2013.01) [H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 2224/29611 (2013.01); H01L 2224/29655 (2013.01); H01L 2224/29666 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/85986 (2013.01); H01L 2924/15153 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A fabrication method for a package structure, comprising:
(a) providing a copper foil;
(b) performing electroplating on the copper foil to form a cavity sacrificial post;
(c) laminating a dielectric material to form a dielectric layer, wherein an end face of the cavity sacrificial post is exposed to the dielectric layer;
(d) forming a wiring layer on the dielectric layer;
(e) removing the cavity sacrificial post by etching to form a through cavity;
(f) forming a bonding pad on the wiring layer; and
(g) mounting a reverse side of a device on the copper foil in the through cavity, and wire-bonding a terminal of the device with the bonding pad.