US 12,300,499 B2
Polishing solution, polishing apparatus, and polishing method
Mikiya Sakashita, Nagoya Aichi (JP); and Yukiteru Matsui, Nagoya Aichi (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Sep. 10, 2021, as Appl. No. 17/447,343.
Claims priority of application No. 2021-040133 (JP), filed on Mar. 12, 2021.
Prior Publication US 2022/0290009 A1, Sep. 15, 2022
Int. Cl. H01L 21/306 (2006.01); B24B 1/00 (2006.01); B24B 37/015 (2012.01); B24B 37/04 (2012.01); B24B 37/10 (2012.01); B24B 41/06 (2012.01); C09G 1/02 (2006.01); C09G 1/18 (2006.01); H01L 21/321 (2006.01)
CPC H01L 21/30625 (2013.01) [B24B 1/00 (2013.01); B24B 37/015 (2013.01); B24B 37/044 (2013.01); B24B 37/107 (2013.01); B24B 41/068 (2013.01); C09G 1/02 (2013.01); C09G 1/18 (2013.01); H01L 21/3212 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A polishing method, comprising:
holding an object to be polished;
starting supply of a polishing solution to an upper surface of a polishing cloth, and starting application of an alternating magnetic field to the polishing solution, wherein the polishing solution comprises:
an exothermic agent that generates heat through the application of the alternating magnetic field to the polishing solution; and
a viscosity modifier that undergoes a reversible phase transition between a gel state and a sol state depending on temperature; and
bringing the object to be polished into contact with the upper surface of the polishing cloth to start polishing of the object to be polished.