US 12,298,923 B2
Compression attached memory module for offset stacking
Arnold Thomas Schnell, Hutto, TX (US); and Joseph Daniel Mallory, Cedar Park, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by DELL PRODUCTS L.P., Round Rock, TX (US)
Filed on Jul. 18, 2022, as Appl. No. 17/866,759.
Application 17/866,759 is a continuation in part of application No. 16/935,852, filed on Jul. 22, 2020, granted, now 11,394,141.
Prior Publication US 2022/0350754 A1, Nov. 3, 2022
Int. Cl. G06F 13/16 (2006.01); G06F 12/06 (2006.01)
CPC G06F 13/16 (2013.01) [G06F 12/0646 (2013.01); G06F 2213/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A compression attached memory module (CAMM), comprising:
a first memory device;
a first array of compression contact pads to receive a first memory channel and a second memory channel, the first memory channel coupled to the first memory device; and
a second array of compression contact pads coupled to a subset of the first compression contact pads associated with the second memory channel.