US 12,298,814 B2
Bracket, bracket manufacturing method and electronic device, including the same
Heesung Lee, Suwon-si (KR); Goeun Kim, Suwon-si (KR); Inkyu Kim, Suwon-si (KR); Hyunsoo Kim, Suwon-si (KR); Hyesun Park, Suwon-si (KR); Youngjun Heo, Suwon-si (KR); and Youngsoo Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Sep. 30, 2022, as Appl. No. 17/957,896.
Application 17/957,896 is a continuation of application No. PCT/KR2022/014637, filed on Sep. 29, 2022.
Claims priority of application No. 10-2021-0130066 (KR), filed on Sep. 30, 2021.
Prior Publication US 2023/0102327 A1, Mar. 30, 2023
Int. Cl. H05K 5/02 (2006.01); G06F 1/16 (2006.01); H05K 5/04 (2006.01)
CPC G06F 1/1656 (2013.01) [H05K 5/0243 (2013.01); H05K 5/04 (2013.01); Y10T 29/49888 (2015.01); Y10T 29/49986 (2015.01); Y10T 29/49995 (2015.01)] 11 Claims
OG exemplary drawing
 
1. A method for manufacturing a bracket of an electronic device, the method comprising:
polishing a surface of a metal member that forms at least a portion of the bracket, wherein the surface comprise a first area and a second area of the metal member;
disposing a masking layer on the first area of the metal member;
forming a second texture on the second area of the metal member, wherein the second texture is different from that of the first area;
removing the masking layer from the first area; and
forming an oxide film layer on the first area and the second area.