US 12,298,749 B2
Method and device for predicting defects
Taelim Choi, Seoul (KR); and Jun Haeng Lee, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 19, 2022, as Appl. No. 17/748,241.
Claims priority of application No. 10-2021-0110942 (KR), filed on Aug. 23, 2021.
Prior Publication US 2023/0054159 A1, Feb. 23, 2023
Int. Cl. G05B 19/418 (2006.01)
CPC G05B 19/41875 (2013.01) [G05B 2219/32222 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A processor-implemented defect prediction method, comprising:
determining a sequence, being a sequential order of execution of a plurality of sub-models, by modeling a production process into the plurality of sub-models;
mapping production process data into each of the plurality of sub-models;
determining, by a corresponding sub-model, output data comprising defect information on a potential defect occurring in a corresponding step based on predicted third data of the corresponding sub-model and measured third data, for each of the plurality of sub-models;
predicting information associated with a defect in the production process based on the output data corresponding to each of the plurality of sub-models; and
inputting the output data of each of the sub-models to a subsequent sub-model of the corresponding sub-model, based on the sequence.