US 12,298,675 B2
Projection exposure apparatus for semiconductor lithography with a vibration damper and method for designing a vibration damper
Philipp Gaida, Aalen (DE); Michael Erath, Dietenheim (DE); and Florian Herold, Aalen (DE)
Assigned to Carl Zeiss SMT GmbH, Oberkochen (DE)
Filed by Carl Zeiss SMT GmbH, Oberkochen (DE)
Filed on Nov. 18, 2022, as Appl. No. 17/989,813.
Application 17/989,813 is a continuation of application No. PCT/EP2021/059809, filed on Apr. 15, 2021.
Claims priority of application No. 102020206591.8 (DE), filed on May 27, 2020.
Prior Publication US 2023/0081234 A1, Mar. 16, 2023
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/709 (2013.01) [G03F 7/70825 (2013.01); G03F 7/70891 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a vibration damper, comprising:
a holder;
a mass;
a damping element connecting the holder and the mass, the damping element having a natural frequency which depends on a temperature of the damping element; and
a temperature control device; and
a controller configured to:
i) received a signal from a sensor; and
ii) based on the signal received from the sensor and a desired natural frequency of the damping element, dynamically control the temperature control device so that the temperature control device either heats or cools the damping element to adjust a temperature of the damping element so that the damping element has the desired natural frequency,
wherein the apparatus is a semiconductor lithography projection exposure apparatus.