US 12,298,633 B2
Display device
Han Ho Park, Yongin-si (KR); Dae Geun Lee, Hwaseong-si (KR); Su Jeong Kim, Gimcheon-si (KR); Sang Won Yeo, Cheonan-si (KR); Kyung Mok Lee, Bucheon-si (KR); and Wu Hyen Jung, Seoul (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Dec. 12, 2023, as Appl. No. 18/537,672.
Application 18/537,672 is a continuation of application No. 17/743,101, filed on May 12, 2022, granted, now 11,874,569.
Application 17/743,101 is a continuation of application No. 17/025,857, filed on Sep. 18, 2020, granted, now 11,347,120, issued on May 31, 2022.
Application 17/025,857 is a continuation of application No. 16/422,708, filed on May 24, 2019, granted, now 10,782,573, issued on Sep. 22, 2020.
Application 16/422,708 is a continuation of application No. 15/807,455, filed on Nov. 8, 2017, granted, now 10,303,017, issued on May 28, 2019.
Claims priority of application No. 10-2016-0161408 (KR), filed on Nov. 30, 2016.
Prior Publication US 2024/0111194 A1, Apr. 4, 2024
Int. Cl. G02F 1/1345 (2006.01); G02F 1/1333 (2006.01); G09F 9/35 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01)
CPC G02F 1/13452 (2013.01) [G02F 1/13458 (2013.01); G09F 9/35 (2013.01); H01L 24/06 (2013.01); H05K 1/117 (2013.01); H05K 1/118 (2013.01); H05K 3/321 (2013.01); G02F 1/133305 (2013.01); G02F 1/13454 (2013.01); H01L 2224/50 (2013.01); H01L 2224/79 (2013.01); H01L 2224/86 (2013.01); H01L 2225/06579 (2013.01); H05K 2201/09427 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10681 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A display device comprising:
a substrate;
conductive pads arranged on the substrate, the conductive pads including a first conductive pad, a second conductive pad, a third conductive pad, a fourth conductive pad, and a fifth conductive pad; and
a circuit chip including bumps electrically connected with the conductive pads, the bumps including a first bump overlapping the first conductive pad, a second bump overlapping the second conductive pad, a third bump overlapping the third conductive pad, a fourth bump overlapping the fourth conductive pad, and a fifth bump overlapping the fifth conductive pad,
wherein the first conductive pad, the second conductive pad, the third conductive pad, the fourth conductive pad, and the fifth conductive pad are arranged in a first direction,
wherein at least one of the second conductive pad, the third conductive pad, and the fourth conductive pad is extended in a second direction intersecting the first direction,
wherein each of the second conductive pad, the third conductive pad, and the fourth conductive pad includes a first end overlapping a first reference line extending in the first direction and a second end opposite to the first end in the second direction and overlapping a second reference line extending in the first direction,
wherein each of the second bump, the third bump, and the fourth bump includes a first end and a second end opposite to the first end in the second direction, and
wherein the first end of one of the second bump, the third bump, and the fourth bump is shifted in the second direction relative to the first end of another one of the second bump, the third bump, and the fourth bump.