US 12,298,628 B2
Electronic device having sealing structure
Fiona Jhan, Pingtung (TW); and Lavender Cheng, Tainan (TW)
Assigned to Innolux Corporation, Miao-Li County (TW)
Filed by Innolux Corporation, Miao-Li County (TW)
Filed on Feb. 29, 2024, as Appl. No. 18/592,145.
Application 18/592,145 is a continuation of application No. 17/964,761, filed on Oct. 12, 2022, granted, now 11,947,222.
Application 17/964,761 is a continuation of application No. 16/944,149, filed on Jul. 31, 2020, granted, now 11,500,248, issued on Nov. 15, 2022.
Prior Publication US 2024/0201543 A1, Jun. 20, 2024
Int. Cl. G02F 1/1339 (2006.01); G02F 1/1343 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01)
CPC G02F 1/1339 (2013.01) [G02F 1/134309 (2013.01); H05K 1/0296 (2013.01); H05K 1/14 (2013.01); G02F 1/134372 (2021.01); G02F 1/13439 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate comprising an edge, a display area and a peripheral area disposed between the edge and the display area;
a first inorganic insulating layer disposed on the substrate;
an organic insulating layer disposed on the first inorganic insulating layer, and having a recess in the peripheral area, wherein in a top view, the recess extends in a first direction parallel to the edge of the substrate; and
a second inorganic insulating layer disposed on the organic insulating layer and in the recess,
wherein in a cross-sectional view, the recess has a bottom portion adjacent to the substrate, and a width of the bottom portion of the recess is greater than a thickness of the organic insulating layer, and
wherein the organic insulating layer and the second inorganic insulating layer are in contact with a top surface of the first inorganic insulating layer.