US 12,298,621 B2
Light-emitting substrate and manufacturing method thereof, backlight module and display apparatus
Bing Zhang, Beijing (CN); Jianwei Qin, Beijing (CN); Xiao Wang, Beijing (CN); Kangli Wang, Beijing (CN); and Liang Gao, Beijing (CN)
Assigned to HEFEI BOE RUISHENG TECHNOLOGY CO., LTD., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 18/247,394
Filed by Hefei BOE Ruisheng Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Jun. 30, 2022, PCT No. PCT/CN2022/102840
§ 371(c)(1), (2) Date Mar. 30, 2023,
PCT Pub. No. WO2024/000411, PCT Pub. Date Jan. 4, 2024.
Prior Publication US 2024/0369877 A1, Nov. 7, 2024
Int. Cl. G02F 1/13357 (2006.01); F21V 8/00 (2006.01); G02F 1/1335 (2006.01)
CPC G02F 1/133606 (2013.01) [G02B 6/0051 (2013.01); G02B 6/0073 (2013.01); G02B 6/0076 (2013.01); G02B 6/0091 (2013.01); G02F 1/133603 (2013.01); G02F 1/133612 (2021.01)] 19 Claims
OG exemplary drawing
 
1. A light-emitting substrate, comprising:
a circuit board;
a plurality of light-emitting devices disposed on the circuit board;
a reflective layer disposed on the circuit board, wherein the reflective layer is provided with a plurality of openings therein, and a light-emitting device in the plurality of light-emitting devices is located in an opening in the plurality of openings;
a support layer disposed on a side of the circuit board away from the reflective layer,
a barrier wall disposed on a surface of the reflective layer away from the circuit board, wherein an orthographic projection of the barrier wall on the circuit board is located within an orthographic projection of the reflective layer on the circuit board, and the barrier wall defines a plurality of sub-regions; and
an encapsulation layer disposed on a side of the circuit board away from the support layer and covering at least the plurality of light-emitting devices.