US 12,298,618 B2
Display module, manufacturing method thereof, and display device
Guangnan Zou, Shenzhen (CN)
Assigned to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Shenzhen (CN)
Appl. No. 17/431,141
Filed by TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Shenzhen (CN)
PCT Filed Jun. 18, 2021, PCT No. PCT/CN2021/100772
§ 371(c)(1), (2) Date Dec. 15, 2022,
PCT Pub. No. WO2022/257168, PCT Pub. Date Dec. 15, 2022.
Claims priority of application No. 202110637784.9 (CN), filed on Jun. 8, 2021.
Prior Publication US 2023/0408859 A1, Dec. 21, 2023
Int. Cl. G02F 1/1335 (2006.01)
CPC G02F 1/133528 (2013.01) [G02F 1/133512 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A display module, wherein the display module comprises a display panel and a polarizer arranged on a light-exiting side of the display panel, the display panel comprises a first substrate and a second substrate arranged opposite to each other, and a liquid crystal layer disposed between the first substrate and the second substrate, and the polarizer is disposed on a side of the second substrate away from the first substrate;
wherein the display module further comprises:
a display area and a non-display area adjacent to the display area, and the non- display area comprises a stepped sub-area located at one side of the display area;
a black matrix disposed between the first substrate and the second substrate, and the black matrix is located in the non-display area; and
a chip-on-film bound on the bonding section;
wherein the first substrate comprises a bonding section located in the stepped sub-area, the polarizer comprises an extension section extending into the stepped sub-area, a black shielding layer is disposed on one side of the extension section, and an orthographic projection of the black shielding layer on the first substrate at least covers the bonding section; and
wherein an orthographic projection of the black shielding layer in a direction perpendicular to a plane where the display panel is located covers orthographic projections of the chip-on-film and the bonding section in the direction perpendicular to the plane where the display panel is located.