US 12,298,323 B2
System for automating processing of sample for analysis and method of processing sample using the same
Chan Hyuk Rhee, Icheon-si (KR); Jong Hee Yoo, Icheon-si (KR); and Kee Jeung Lee, Icheon-si (KR)
Assigned to SK hynix Inc., Icheon-si (KR)
Filed by SK hynix Inc., Icheon-si (KR)
Filed on Nov. 10, 2022, as Appl. No. 18/054,278.
Claims priority of application No. 10-2021-0157807 (KR), filed on Nov. 16, 2021; and application No. 10-2022-0105017 (KR), filed on Aug. 22, 2022.
Prior Publication US 2023/0152341 A1, May 18, 2023
Int. Cl. G01N 35/04 (2006.01); G01N 1/04 (2006.01); G01N 35/00 (2006.01)
CPC G01N 35/04 (2013.01) [G01N 1/04 (2013.01); G01N 35/00732 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for automating processing of a sample for analysis, the system comprising:
a sample processing unit configured to manufacture a plurality of unit wafers by cutting an analysis target wafer and to manufacture a sample for analysis by applying at least one process to one of the plurality of unit wafers;
a sample storage unit including a loading area having a plurality of reception holders, on which a unit wafer and the sample for analysis have been loaded, that are carried in and out; and
a sample conveying unit configured to convey the analysis target wafer, the unit wafer, and the sample for analysis respectively between the sample processing unit and the sample storage unit,
wherein a reception holder comprises:
a holder body;
a first reception stage formed on one side of and at a top of the holder body and to which the unit wafer is removably coupled,
wherein the first reception stage comprises a clamp unit,
wherein the clamp unit comprises:
a fixing groove inserted on the one side of the holder body and on an upper side of the holder body;
a support plate installed within the fixing groove and configured to have the unit wafer seated at a top of the support plate and a shaft formed at a bottom of the support plate;
an elastic member installed along an outer circumference surface of the shaft; and
an elastic clip equipped with a trapping protrusion that protrudes from an inner wall of the fixing groove,
wherein the clamp unit removably fixes the unit wafer to an upper side when the unit wafer is pressed.