US 12,298,045 B2
Refrigerant pump and data center cooling system
Hui Wang, Xi'an (CN); and Peng Cheng, Xi'an (CN)
Assigned to Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed by Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed on Nov. 18, 2022, as Appl. No. 17/990,076.
Application 17/990,076 is a continuation of application No. PCT/CN2020/091111, filed on May 19, 2020.
Prior Publication US 2023/0083147 A1, Mar. 16, 2023
Int. Cl. F28F 27/00 (2006.01); F25B 25/00 (2006.01); F25B 41/00 (2021.01); H05K 7/20 (2006.01)
CPC F25B 41/00 (2013.01) [F25B 25/00 (2013.01); H05K 7/208 (2013.01); F25B 2400/0401 (2013.01); F25B 2500/03 (2013.01); F25B 2600/2501 (2013.01); F25B 2700/04 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A refrigerant pump, comprising:
a housing, wherein the housing is provided with a liquid inlet, a liquid outlet, a first space, and a second space that are disposed side by side in the housing and that are isolated from each other, the first space is configured to store refrigerant of a cooling system, and the liquid inlet is configured to be directly connected to a condenser of the cooling system by using a pipeline; and
a pump head, wherein an inlet of the pump head is located at the bottom of the first space in a gravity direction, the pump head is configured to transfer the refrigerant in the first space to the second space, and the refrigerant in the second space is output through the liquid outlet.