| CPC C25D 21/12 (2013.01) [C25D 17/04 (2013.01); C25D 17/06 (2013.01)] | 9 Claims |

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1. An apparatus for plating that is configured to plate a substrate, the apparatus comprising:
a plating tank;
an anode placed in the plating tank;
a rotation mechanism configured to rotate the substrate in a first direction and in a second direction that is opposite to the first direction; and
a control device configured to control the rotation mechanism, such that a time period when the substrate is rotated in the first direction becomes equal to a time period when the substrate is rotated in the second direction, and/or such that a time integrated value of a rotation speed in the first direction becomes equal to a time integrated value of a rotation speed in the second direction,
wherein the control device is configured to control the rotation mechanism to rotate the substrate for a unit period one or more times during plating of the substrate, wherein the unit period includes a first direction rotating period during which the substrate is continuously rotated in the first direction and a second direction rotating period during which the substrate is continuously rotated in the second direction,
wherein the control device is configured to control the first direction rotating period and/or the second direction rotating period in a plurality of steps with regard to part or an entirety of the unit period, wherein each of the plurality of steps has a constant speed period when the substrate is rotated at a fixed rotation speed, and at least two steps among the plurality of steps have different fixed rotation speeds.
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