US 12,297,553 B2
Device and method for forming electroformed component
Gordon Tajiri, Waynesville, OH (US); Emily Marie Phelps, Bellbrook, OH (US); Dattu G V Jonnalagadda, Ponnur (IN); Joseph Richard Schmitt, Springfield, OH (US); and Yanzhe Yang, Mason, OH (US)
Assigned to Unison Industries, LLC, Jacksonville, FL (US)
Filed by Unison Industries, LLC, Jacksonville, FL (US)
Filed on Jun. 22, 2018, as Appl. No. 16/015,295.
Claims priority of provisional application 62/577,386, filed on Oct. 26, 2017.
Prior Publication US 2019/0127869 A1, May 2, 2019
Int. Cl. C25D 1/00 (2006.01)
CPC C25D 1/00 (2013.01) 24 Claims
OG exemplary drawing
 
1. An electroforming assembly for electroforming a component electroform assembly comprising:
a first fluid reservoir with a first electrolytic fluid;
a first anode submerged within the first electrolytic fluid within the first fluid reservoir;
a cathode submerged in the first electrolytic fluid;
a forming manifold with a housing submerged in the first electrolytic fluid and spaced from the cathode;
a fluid delivery passage defined by passage walls, with the passage walls extending through the housing and terminating at a nozzle tip extending from the housing, spaced from the cathode, and oriented toward the cathode;
an auxiliary anode layered on an exterior surface of at least one of the housing or the passage walls of the fluid delivery passage at the nozzle tip and facing the cathode; and
a second fluid reservoir with a second electrolytic fluid fluidly coupled to the fluid delivery passage.