US 12,297,545 B2
Apparatus and method of treating substrate
Jun Kil Hwang, Gyeonggi-do (KR); Min Jung Kim, Chungcheongnam-do (KR); Hee Hwan Kim, Sejong-si (KR); and Seong Soo Lee, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Dec. 27, 2022, as Appl. No. 18/146,489.
Claims priority of application No. 10-2021-0188982 (KR), filed on Dec. 27, 2021; and application No. 10-2022-0020262 (KR), filed on Feb. 16, 2022.
Prior Publication US 2023/0203672 A1, Jun. 29, 2023
Int. Cl. C23F 1/46 (2006.01); B08B 3/02 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); H01L 21/02 (2006.01)
CPC C23F 1/46 (2013.01) [B08B 3/022 (2013.01); B08B 3/041 (2013.01); B08B 3/08 (2013.01); B08B 2203/007 (2013.01); H01L 21/02057 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of treating a substrate, the method comprising:
treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate directly or via another tank, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid,
wherein the treatment liquid includes a chemical liquid and a diluting solution,
a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and
the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.
 
10. A method of treating a substrate, the method comprising:
performing a treatment of removing a foreign material or a thin film from a substrate by supplying a treatment liquid stored in a main tank to the substrate directly or via another tank; and
recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank and then reusing the recovered treatment liquid,
wherein the treatment liquid contains hydrogen peroxide and water,
the foreign material or thin film contains a metal,
a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and
in the concentration adjustment operation, the treatment liquid in a heated state is discharged from the nozzle, the discharged treatment liquid is recovered to the main tank, and the concentration of the hydrogen peroxide is increased by evaporation of water from the treatment liquid while the treatment liquid is discharged from the nozzle.