US 12,297,536 B2
Substrate processing apparatus and substrate processing method
Manabu Honma, Oshu (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on May 25, 2022, as Appl. No. 17/664,881.
Claims priority of application No. 2021-093193 (JP), filed on Jun. 2, 2021.
Prior Publication US 2022/0389581 A1, Dec. 8, 2022
Int. Cl. C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01)
CPC C23C 16/45544 (2013.01) [C23C 16/4584 (2013.01); H01L 21/0228 (2013.01); H01L 21/68742 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a rotary table provided in a processing container;
a rotation mechanism configured to rotate the rotary table;
a plurality of recesses provided on an upper surface of the rotary table along a rotation direction of the rotary table and configured to accommodate a plurality of substrates, respectively;
a processing gas supply provided above the rotary table and configured to supply a processing gas onto the rotary table to process each of the substrates;
a heater configured to heat the rotary table;
a support configured to support the substrates in upper regions above the recesses so that the heater heats the substrates before being accommodated in the recesses;
an elevating mechanism configured to raise and lower the support relative to the rotary table so that the substrates are collectively moved from the upper regions into the recesses;
a shaft body extending in a vertical direction; and
a cylindrical body configured to surround a side circumference of the shaft body,
wherein one of the shaft body and the cylindrical body is connected to a lower surface of the rotary table while the other of the shaft body and the cylindrical body is connected to the support,
wherein the rotation mechanism is further configured to rotate the support together with the rotary table,
wherein the rotation mechanism is further configured to rotate both the shaft body and the cylindrical body, and
wherein the elevating mechanism is further configured to raise and lower the shaft body with respect to the cylindrical body.