	US 12,297,314 B2
	Curable composition
Jeong Hyun Lee, Daejeon (KR); Yang Gu Kang, Daejeon (KR); Eun Suk Park, Daejeon (KR); Hyoung Sook Park, Daejeon (KR); and Young Jo Yang, Daejeon (KR)
Assigned to LG Chem, Ltd., Seoul (KR)
Appl. No. 17/613,209
Filed by LG Chem, Ltd., Seoul (KR)
PCT Filed Sep. 9, 2020, PCT No. PCT/KR2020/012144 § 371(c)(1), (2) Date Nov. 22, 2021, PCT Pub. No. WO2021/049863, PCT Pub. Date Mar. 18, 2021.
Claims priority of application No. 10-2019-0111236 (KR), filed on Sep. 9, 2019.
Prior Publication US 2022/0227914 A1, Jul. 21, 2022
Int. Cl. C08G 18/10 (2006.01); C08G 18/24 (2006.01); C08G 18/42 (2006.01); C08G 18/73 (2006.01); C08K 3/22 (2006.01); C08K 5/37 (2006.01); H01M 50/204 (2021.01)

CPC C08G 18/10 (2013.01) [C08G 18/246 (2013.01); C08G 18/4277 (2013.01); C08G 18/73 (2013.01); C08K 3/22 (2013.01); C08K 5/37 (2013.01); H01M 50/204 (2021.01); C08K 2003/2227 (2013.01); C08K 2201/003 (2013.01); C08K 2201/014 (2013.01); H01M 2220/20 (2013.01)]

14 Claims

1. A curable composition comprising a polyol, a reaction inhibitor, a catalyst and a thermally conductive filler,

wherein the curable composition is a solventless composition,

an amount of the thermally conductive filler is from 70 to 95 weight % based on a total amount of the curable composition, and

the reaction inhibitor comprises one or more reaction-inhibitory functional groups selected from the group consisting of a mercapto group, an amino group and a phenolic hydroxyl group.