US 12,296,765 B2
Electrical assembly
Aric Anglin, Rives Junction, MI (US); Ajmal Ansari, Canton, MI (US); Greg Dickerhoof, Ann Arbor, MI (US); Robert M. Schmidt, Livonia, MI (US); Rutunj Rai, Canton, MI (US); and Hongen Tu, San Francisco, CA (US)
Assigned to Lear Corporation, Southfield, MI (US)
Filed by Lear Corporation, Southfield, MI (US)
Filed on Nov. 28, 2023, as Appl. No. 18/521,421.
Application 18/521,421 is a continuation of application No. 17/495,131, filed on Oct. 6, 2021, granted, now 11,858,437.
Application 17/495,131 is a continuation in part of application No. 17/395,082, filed on Aug. 5, 2021, granted, now 11,558,963, issued on Jan. 17, 2023.
Application 17/395,082 is a continuation in part of application No. 17/223,738, filed on Apr. 6, 2021, granted, now 11,721,956, issued on Aug. 8, 2023.
Application 17/223,738 is a continuation in part of application No. 17/071,588, filed on Oct. 15, 2020, granted, now 11,547,024, issued on Jan. 3, 2023.
Application 17/223,738 is a continuation in part of application No. 16/592,126, filed on Oct. 3, 2019, granted, now 10,971,873, issued on Apr. 6, 2021.
Claims priority of provisional application 62/915,568, filed on Oct. 15, 2019.
Claims priority of provisional application 62/753,383, filed on Oct. 31, 2018.
Prior Publication US 2024/0092291 A1, Mar. 21, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H02B 1/20 (2006.01); B60R 16/03 (2006.01); H01H 50/04 (2006.01); H01H 50/14 (2006.01); H01R 13/08 (2006.01); H05K 5/00 (2006.01); H02B 1/56 (2006.01)
CPC B60R 16/03 (2013.01) [H01H 50/047 (2013.01); H01H 50/14 (2013.01); H01R 13/08 (2013.01); H02B 1/20 (2013.01); H05K 5/0091 (2013.01); H02B 1/56 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electrical assembly, comprising:
a bus bar assembly;
a sensor assembly, including:
a circuit board fixed directly to the bus bar assembly via a plurality of pins; and
a sensor, wherein at least one pin from the plurality of pins is inserted within the circuit board to transfer heat from the at least one pin to the sensor;
a bracket connected to the bus bar assembly; and
a cooling member connected to the bracket.