US 12,296,569 B2
Substrate laminating apparatus and substrate laminating method
Masashi Honda, Sagamihara (JP)
Assigned to OLYMPUS CORPORATION, Tokyo (JP)
Filed by OLYMPUS CORPORATION, Tokyo (JP)
Filed on May 22, 2023, as Appl. No. 18/200,273.
Application 18/200,273 is a continuation of application No. PCT/JP2021/017271, filed on Apr. 30, 2021.
Prior Publication US 2023/0286256 A1, Sep. 14, 2023
Int. Cl. B32B 41/00 (2006.01); B32B 37/00 (2006.01); B32B 37/12 (2006.01); C09J 5/00 (2006.01)
CPC B32B 37/0046 (2013.01) [B32B 37/1284 (2013.01); B32B 41/00 (2013.01); C09J 5/00 (2013.01); B32B 2551/00 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A substrate laminating apparatus configured to laminate a second substrate on a first substrate with uncured adhesive therebetween, the substrate laminating apparatus comprising:
a first holding mechanism configured to hold the first substrate;
a second holding mechanism configured to hold the second substrate;
a driving mechanism configured to control a relative distance between the first substrate and the second substrate;
a load detecting mechanism configured to detect a load between the first substrate and the second substrate, the load depending on a surface tension of the uncured adhesive, which surface tension is determined by spread of the uncured adhesive, which spread is determined by the relative distance between the first substrate and the second substrate;
wherein the driving mechanism controls the relative distance between the first substrate and the second substrate such that the first substrate and the second substrate approach each other to vary surface tension of the uncured adhesive until the load detecting mechanism detects the load has reached a predetermined value, and
the uncured adhesive includes at least one of a UV-curable adhesive, a light-curable adhesive, thermosetting adhesive or radiation-curable adhesive.