US 12,296,427 B2
Apparatus and method for CMP temperature control
Haosheng Wu, San Jose, CA (US); Shou-Sung Chang, Mountain View, CA (US); Chih Chung Chou, San Jose, CA (US); Jianshe Tang, San Jose, CA (US); Hui Chen, San Jose, CA (US); Hari Soundararajan, Sunnyvale, CA (US); and Brian J. Brown, Palo Alto, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 10, 2020, as Appl. No. 16/989,734.
Claims priority of provisional application 62/886,260, filed on Aug. 13, 2019.
Prior Publication US 2021/0046604 A1, Feb. 18, 2021
Int. Cl. B24B 37/015 (2012.01); B24B 57/02 (2006.01); H01L 21/321 (2006.01); H01L 21/67 (2006.01)
CPC B24B 37/015 (2013.01) [B24B 57/02 (2013.01); H01L 21/3212 (2013.01); H01L 21/67248 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing system, comprising:
a platen to support a polishing pad having a polishing surface;
a gas source which supplies a coolant gas selected from a group consisting of nitrogen, carbon dioxide, argon, evaporated ethanol, or evaporated isopropyl alcohol;
a conduit having an inlet to be coupled to the gas source;
a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct coolant gas from the gas source onto the polishing surface of the polishing pad;
an injector traversing a sidewall of a throat of the convergent-divergent nozzle and having an inlet to be coupled to a liquid source and an outlet positioned in the throat to deliver a liquid from the liquid source into the throat along a centerline of the convergent-divergent nozzle; and
a controller configured to be coupled to the gas source and to cause a flow rate of the coolant gas through the convergent-divergent nozzle to be such that the coolant gas is cooled from an initial temperature above 20° C. to below 0° C.