US 12,296,404 B2
Processing apparatus and processing method for removal processing with a light beam and having a workpiece position measurement system
Yuichi Shibazaki, Kumagaya (JP)
Assigned to NIKON CORPORATION, Tokyo (JP)
Filed by NIKON CORPORATION, Tokyo (JP)
Filed on Apr. 4, 2023, as Appl. No. 18/130,610.
Application 18/130,610 is a continuation of application No. 16/668,305, filed on Oct. 30, 2019, granted, now 11,691,217.
Application 16/668,305 is a continuation of application No. PCT/JP2018/016986, filed on Apr. 26, 2018.
Claims priority of application No. PCT/JP2017/017119 (WO), filed on May 1, 2017.
Prior Publication US 2023/0256536 A1, Aug. 17, 2023
Int. Cl. B23K 26/06 (2014.01); B23K 26/03 (2006.01); B23K 26/064 (2014.01); B23K 26/066 (2014.01); B23K 26/073 (2006.01); B23K 26/08 (2014.01); B23K 26/70 (2014.01); B23Q 3/18 (2006.01)
CPC B23K 26/0665 (2013.01) [B23K 26/03 (2013.01); B23K 26/0344 (2015.10); B23K 26/064 (2015.10); B23K 26/0643 (2013.01); B23K 26/0648 (2013.01); B23K 26/066 (2015.10); B23K 26/073 (2013.01); B23K 26/0861 (2013.01); B23K 26/705 (2015.10); B23Q 3/186 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A processing apparatus for performing removal processing on a first workpiece by irradiating the first workpiece with a light beam, the processing apparatus comprising:
a first holding system that has a first holding member on which the first workpiece is placed and that is configured to move the first holding member to move the first workpiece held by the first holding member;
a beam irradiation system including a condensing optical system configured to emit the light beam;
a measurement system including a three-dimensional measuring device configured to acquire position information of the first workpiece held by the first holding member;
a controller; and
a second holding system that has a second holding member on which a second workpiece, which is different from the first workpiece, is placed and that moves the second holding member to move the second workpiece held by the second holding member, wherein
the controller performs control such that
the removal processing is performed on a target portion of the first workpiece while the first holding member and the light beam from the condensing optical system are relatively moved, and
while the removal processing is performed on the first workpiece held by the first holding member, position information of the second workpiece held by the second holding member is acquired with the measurement system.
 
20. A processing method of performing removal processing on a first workpiece by irradiating the first workpiece with a light beam, the method comprising:
holding the first workpiece on a first holding member;
moving the first holding member to move the first workpiece held by the first holding member;
acquiring position information of the first workpiece held by the first holding member with a measurement system including a three-dimensional measuring device;
performing, based on a measurement result of the measurement system, the removal processing on a target portion of the first workpiece while the first holding member on which the first workpiece is held and a light beam emitted from a beam irradiation system, which includes a condensing optical system, are relatively moved;
holding a second workpiece, which is different from the first workpiece, on a second holding member;
moving the second holding member to move the second workpiece held by the second holding member; and
while the removal processing is performed on the first workpiece held by the first holding member, acquiring position information of the second workpiece held by the second holding member with the measurement system.