US 12,295,583 B2
Implant delivery system
Tai D. Tieu, Aliso Viejo, CA (US); Hideo Morita, Aliso Viejo, CA (US); and Helen Nguyen, Aliso Viejo, CA (US)
Assigned to MicroVention, Inc., Aliso Viejo, CA (US)
Filed by MicroVention, Inc., Aliso Viejo, CA (US)
Filed on Dec. 13, 2023, as Appl. No. 18/539,170.
Application 18/539,170 is a continuation of application No. 17/177,020, filed on Feb. 16, 2021, granted, now 11,857,196.
Application 17/177,020 is a continuation of application No. 16/153,267, filed on Oct. 5, 2018, abandoned.
Application 16/153,267 is a continuation of application No. 15/631,833, filed on Jun. 23, 2017, abandoned.
Application 15/631,833 is a continuation of application No. 12/761,113, filed on Apr. 15, 2010, granted, now 9,717,500, issued on Aug. 1, 2017.
Claims priority of provisional application 61/169,629, filed on Apr. 15, 2009.
Prior Publication US 2024/0108352 A1, Apr. 4, 2024
Int. Cl. A61B 17/12 (2006.01); A61B 90/00 (2016.01); A61F 2/01 (2006.01); A61F 2/95 (2013.01)
CPC A61B 17/12113 (2013.01) [A61B 17/12022 (2013.01); A61B 17/12154 (2013.01); A61B 90/39 (2016.02); A61F 2/01 (2013.01); A61F 2/95 (2013.01); A61B 2017/12068 (2013.01); A61F 2/011 (2020.05); A61F 2002/9505 (2013.01); A61F 2002/9511 (2013.01); A61F 2250/0071 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An implant delivery system, comprising:
a pusher comprising an elongated shape, wherein a distal end of the pusher is configured to connect to an implant;
a tether connected to the pusher and contacts the implant;
a heating element mounted over the tether, biased to separate a first surface of the heating element away from a second surface of the pusher; and
an expander disposed between the first surface of the heating element and the second surface of the pusher, wherein the expander is configured to melt, allowing the first surface to electrically contact the second surface with reduced gap between loops of the heating element, upon activation of the heating element.