US 12,295,269 B2
Low-cost and high-strength bi-based superconducting wire/tape and preparation method thereof
Qingbin Hao, Xi'an (CN); Jianfeng Li, Xi'an (CN); Shengnan Zhang, Xi'an (CN); Lihua Jin, Xi'an (CN); Xiaoyan Xu, Xi'an (CN); Gaofeng Jiao, Xi'an (CN); Kai Yao, Xi'an (CN); Chengshan Li, Xi'an (CN); Guoqing Liu, Xi'an (CN); Zhenbao Li, Xi'an (CN); Xueqian Liu, Xi'an (CN); Gaoshan Li, Xi'an (CN); Jianqing Feng, Xi'an (CN); and Pingxiang Zhang, Xi'an (CN)
Assigned to NORTHWEST INSTITUTE FOR NONFERROUS METAL RESEARCH, Xi'an (CN)
Filed by NORTHWEST INSTITUTE FOR NONFERROUS METAL RESEARCH, Xi'an (CN)
Filed on May 3, 2024, as Appl. No. 18/654,071.
Application 18/654,071 is a continuation of application No. PCT/CN2024/071771, filed on Jan. 11, 2024.
Claims priority of application No. 202310565846.9 (CN), filed on May 19, 2023.
Prior Publication US 2024/0389474 A1, Nov. 21, 2024
Int. Cl. H10N 60/01 (2023.01); H10N 60/85 (2023.01)
CPC H10N 60/0128 (2023.02) [H10N 60/855 (2023.02)] 8 Claims
OG exemplary drawing
 
1. A low-cost and high-strength Bi-based superconducting wire/tape prepared by a preparation method of the low-cost and high-strength Bi-based superconducting wire/tape, wherein the low-cost and high strength Bi-based superconducting wire/tape includes at least one of: Ag or an Ag alloy as a sheathing material, and a copper layer as a coating, wherein a content of the Ag in the Ag or an Ag alloy as a sheathing material is about 50%, wherein the low-cost and high-strength Bi-based superconducting wire/tape is prepared at least in part by an electrochemical silver reduction process with an ultra-low stress, wherein the low-cost and high-strength Bi-based superconducting wire/tape is fabricated by a method comprising following steps:
step 1: electrochemical silver reduction: connecting a first Bi-based superconducting wire/tape to a positive electrode of a stabilized voltage power supply, connecting a graphite electrode to a negative electrode of the stabilized voltage power supply, and arranging the first Bi-based superconducting wire/tape and the graphite electrode in parallel on a bracket; and adding an electrolyte to allow the electrochemical silver reduction, such that a Ag alloy layer on a surface of the first Bi-based superconducting wire/tape is removed to obtain a second Bi-based superconducting wire/tape; and
step 2: surface enhancement: connecting the second Bi-based superconducting wire/tape obtained after the electrochemical silver reduction in the step 1 to the negative electrode of the stabilized voltage power supply, connecting a copper sheet to the positive electrode of the stabilized voltage power supply, and arranging the second Bi-based superconducting wire/tape and the copper sheet in parallel on the bracket; and adding an electrochemical additive solution to allow the surface reinforcement, such that a Cu layer is formed on a surface of the second Bi-based superconducting wire/tape to obtain the low-cost and high-strength Bi-based superconducting wire/tape, wherein:
in the step 2, a distance between the second Bi-based superconducting wire/tape and the copper sheet is 2 cm to 5 cm,
a current density of the surface of the second Bi-based superconducting wire/tape is 0.1 A/dm2 to 10 A/dm2,
the surface enhancement is conducted for 0.1 min to 20 min, and
a thickness of the Cu layer is 10 μm to 40 μm.