US 12,295,265 B2
Thermoelectric module and method for manufacturing thermoelectric module post
Hiroyuki Matsunami, Hiratsuka (JP); and Tetsushi Tanaka, Fujisawa (JP)
Assigned to KELK Ltd., Hiratsuka (JP)
Appl. No. 17/766,777
Filed by KELK Ltd., Hiratsuka (JP)
PCT Filed Oct. 5, 2020, PCT No. PCT/JP2020/037686
§ 371(c)(1), (2) Date Apr. 6, 2022,
PCT Pub. No. WO2021/075286, PCT Pub. Date Apr. 22, 2021.
Claims priority of application No. 2019-189373 (JP), filed on Oct. 16, 2019.
Prior Publication US 2024/0099141 A1, Mar. 21, 2024
Int. Cl. H10N 10/82 (2023.01); H10N 10/17 (2023.01)
CPC H10N 10/82 (2023.02) [H10N 10/17 (2023.02)] 3 Claims
OG exemplary drawing
 
1. A thermoelectric module comprising:
a lower substrate;
an upper substrate that is disposed above the lower substrate and faces the lower substrate;
a plurality of p-type and n-type thermoelectric elements that are disposed between the lower substrate and the upper substrate;
a first electrode that is disposed on an upper surface of the lower substrate and a lower surface of the upper substrate and forms a series circuit by alternately and sequentially connecting the p-type and n-type thermoelectric elements; and
a second electrode that is provided on the lower substrate and connects a thermoelectric element at an end portion of the series circuit and a post;
wherein the post includes:
a post main body that is formed of titanium;
a titanium passive film that is an oxide film formed to cover a side surface of the post main body;
a first plated portion provided on a first surface of the post connected to the second electrode and formed of an alloy of gold and tin; and
a second plated portion provided on a second surface of the post and formed of gold, the second surface being opposite to the first surface of the post.