US 12,295,221 B2
Display panel and display device having an adhesive layer between an organic layer and an inorganic layer to enhance the bonding force of an interface
Yunti Zhang, Wuhan (CN)
Assigned to WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Wuhan (CN)
Appl. No. 17/296,216
Filed by WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Wuhan (CN)
PCT Filed Mar. 26, 2021, PCT No. PCT/CN2021/083313
§ 371(c)(1), (2) Date May 21, 2021,
PCT Pub. No. WO2022/193353, PCT Pub. Date Sep. 22, 2022.
Claims priority of application No. 202110273994.4 (CN), filed on Mar. 15, 2021.
Prior Publication US 2023/0060896 A1, Mar. 2, 2023
Int. Cl. H10K 59/131 (2023.01); G06F 3/041 (2006.01); H10K 59/40 (2023.01); H10K 71/00 (2023.01); G06F 3/044 (2006.01); H10K 59/12 (2023.01)
CPC H10K 59/131 (2023.02) [G06F 3/0412 (2013.01); G06F 3/04164 (2019.05); H10K 59/40 (2023.02); H10K 71/00 (2023.02); G06F 3/0443 (2019.05); G06F 2203/04103 (2013.01); H10K 59/1201 (2023.02)] 16 Claims
OG exemplary drawing
 
1. A display panel, comprising a display area and a non-display area positioned at one side of the display area, wherein the non-display area comprises a bonding area, and the display panel in the bonding area further comprises:
a substrate;
a signal line pattern disposed on the substrate;
an insulation protection layer disposed on the signal line pattern, wherein an opening is provided at a position corresponding to the signal line pattern, and the opening exposes at least part of the signal line pattern; and
a bonding terminal disposed on the insulation protection layer and electrically connected to the signal line pattern through the at least part of the signal line pattern in the opening;
wherein, the insulation protection layer comprises an adhesive layer and an organic layer and an inorganic layer disposed on opposite sides of the adhesive layer, and a surface roughness of the adhesive layer is greater than a surface roughness of the organic layer and a surface roughness of the inorganic layer; wherein a surface of the organic layer which is in contact with the adhesive layer is provided with a concave-convex structure, and a surface of the inorganic layer in contact with the adhesive layer is provided with a concave-convex structure;
wherein an orthographic projection of each convex structure of the concave-convex structure of the organic layer on the substrate is partially outside and partially overlapped with an orthographic projection of a corresponding concave structure of the concave-convex structure of the inorganic layer on the substrate; or
an orthographic projection of each concave structure of the concave-convex structure of the organic layer on the substrate is partially outside and partially overlapped with an orthographic projection of a corresponding convex structure of the concave-convex structure of the inorganic layer on the substrate.