US 12,295,215 B2
Methods of fabricating OLED panel with inorganic pixel encapsulating barrier
Ji-young Choung, Hwaseong-si (KR); Dieter Haas, Santa Clara, CA (US); Yu Hsin Lin, Zhubei (TW); Jungmin Lee, Santa Clara, CA (US); Seong Ho Yoo, San Ramon, CA (US); and Si Kyoung Kim, Gwangju-si (KR)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Dec. 19, 2023, as Appl. No. 18/545,676.
Application 18/545,676 is a continuation of application No. 18/346,059, filed on Jun. 30, 2023, granted, now 11,910,657.
Application 18/346,059 is a continuation of application No. 18/314,915, filed on May 10, 2023.
Application 18/314,915 is a continuation of application No. 18/049,868, filed on Oct. 26, 2022, granted, now 11,690,255, issued on Jun. 27, 2023.
Application 18/049,868 is a continuation of application No. 18/049,825, filed on Oct. 26, 2022, granted, now 11,690,254, issued on Jun. 27, 2023.
Application 18/049,825 is a continuation of application No. 17/498,482, filed on Oct. 11, 2021, granted, now 11,476,313, issued on Oct. 18, 2022.
Application 17/498,482 is a continuation of application No. 17/193,321, filed on Mar. 5, 2021, abandoned.
Application 17/498,482 is a continuation of application No. 17/193,347, filed on Mar. 5, 2021, granted, now 11,610,952, issued on Mar. 21, 2023.
Claims priority of provisional application 63/084,445, filed on Sep. 28, 2020.
Claims priority of provisional application 63/075,025, filed on Sep. 4, 2020.
Claims priority of provisional application 63/075,028, filed on Sep. 4, 2020.
Prior Publication US 2024/0164149 A1, May 16, 2024
Int. Cl. H10K 59/122 (2023.01); H10K 50/84 (2023.01); H10K 50/844 (2023.01); H10K 59/12 (2023.01); H10K 59/173 (2023.01); H10K 59/80 (2023.01); H10K 71/00 (2023.01)
CPC H10K 59/122 (2023.02) [H10K 50/84 (2023.02); H10K 50/844 (2023.02); H10K 59/173 (2023.02); H10K 59/873 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02)] 14 Claims
OG exemplary drawing
 
1. A device, comprising:
a substrate;
overhang structures disposed over the substrate, the overhang structures having a bottommost surface having a bottom width less than a top width of a top surface, the overhang structures comprising a conductive material;
an organic light-emitting diode (OLED) material disposed:
on the top surface of the overhang structures;
on a sidewall of the overhang structures adjacent to the top surface; and
between adjacent overhang structures;
a cathode disposed:
on the OLED material on the top surface of the overhang structures; and
over a sidewall of the overhang structures, the cathode having:
a lower portion disposed along the sidewall adjacent to the bottommost surface with an endpoint before the top surface of the overhang structures; and
an upper portion disposed along the sidewall adjacent to the top surface of the overhang structures; and
between the adjacent overhang structures; and
an encapsulation layer disposed:
over the cathode over the top surface of the overhang structures;
along the sidewall of the overhang structures; and
between the adjacent overhang structures, the encapsulation layer separates the OLED material and the cathode adjacent to the top surface of the overhang structures from the OLED material and the cathode between the adjacent overhang structures, wherein the encapsulation layer contacts the sidewall of the overhang structures between the lower portion of the cathode along the sidewall of the overhang structures and the upper portion of the cathode on the OLED material disposed adjacent to the top surface of the overhang structures.