CPC H10K 59/122 (2023.02) [H10K 50/84 (2023.02); H10K 50/844 (2023.02); H10K 59/173 (2023.02); H10K 59/873 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02)] | 14 Claims |
1. A device, comprising:
a substrate;
overhang structures disposed over the substrate, the overhang structures having a bottommost surface having a bottom width less than a top width of a top surface, the overhang structures comprising a conductive material;
an organic light-emitting diode (OLED) material disposed:
on the top surface of the overhang structures;
on a sidewall of the overhang structures adjacent to the top surface; and
between adjacent overhang structures;
a cathode disposed:
on the OLED material on the top surface of the overhang structures; and
over a sidewall of the overhang structures, the cathode having:
a lower portion disposed along the sidewall adjacent to the bottommost surface with an endpoint before the top surface of the overhang structures; and
an upper portion disposed along the sidewall adjacent to the top surface of the overhang structures; and
between the adjacent overhang structures; and
an encapsulation layer disposed:
over the cathode over the top surface of the overhang structures;
along the sidewall of the overhang structures; and
between the adjacent overhang structures, the encapsulation layer separates the OLED material and the cathode adjacent to the top surface of the overhang structures from the OLED material and the cathode between the adjacent overhang structures, wherein the encapsulation layer contacts the sidewall of the overhang structures between the lower portion of the cathode along the sidewall of the overhang structures and the upper portion of the cathode on the OLED material disposed adjacent to the top surface of the overhang structures.
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