US 12,295,192 B2
Method for producing a component, and component
Alexander F. Pfeuffer, Regensburg (DE); Tobias Berthold, Regensburg (DE); Lutz Höppel, Alteglofsheim (DE); Tobias Meyer, Kelheim (DE); and Korbinian Perzlmaier, Regensburg (DE)
Assigned to OSRAM Opto Semiconductors GmbH, Regensburg (DE)
Appl. No. 17/609,256
Filed by OSRAM Opto Semiconductors GmbH, Regensburg (DE)
PCT Filed May 6, 2020, PCT No. PCT/EP2020/062585
§ 371(c)(1), (2) Date Nov. 5, 2021,
PCT Pub. No. WO2020/225304, PCT Pub. Date Nov. 12, 2020.
Claims priority of application No. 102019111816.6 (DE), filed on May 7, 2019.
Prior Publication US 2022/0238773 A1, Jul. 28, 2022
Int. Cl. H01L 25/00 (2006.01); H01L 25/04 (2023.01); H01L 25/075 (2006.01); H10F 71/00 (2025.01); H10F 77/00 (2025.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01)
CPC H10H 20/857 (2025.01) [H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H10F 71/00 (2025.01); H10F 77/933 (2025.01); H10H 20/0364 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A component comprising:
a carrier;
at least one component part; and
an electrically insulating bonding layer,
wherein the component part is mechanically fixed to the carrier by the electrically insulating bonding layer,
wherein the carrier comprises a connection layer having a connection surface,
wherein the bonding layer is disposed on the carrier and has at least one opening in which the connection surface of the connection layer is located,
wherein the component part comprises a contact layer having a contact surface,
wherein, in top view of the carrier, the contact surface covers the opening of the bonding layer and the connection surface of the connection layer located therein,
wherein the contact surface and the connection surface are directly adjacent to each other so that a direct electrical contact is formed between the contact layer and the connection layer and so that the component part is electrically conductively connected to the carrier,
wherein, in the top view of the carrier, the bonding layer has a first sub-region and a second sub-region directly adjacent to the first sub-region,
wherein the first sub-region has a first surface, which faces away from the carrier, which is directly adjacent to the component part and which is completely covered by the component part,
wherein the second sub-region has a second surface which faces away from the carrier and which is not adjacent to the component part, and
wherein a vertical distance between the first surface and a main body of the carrier is greater than the vertical distance between the second surface and the main body of the carrier.