| CPC H10H 20/825 (2025.01) [H01S 5/3013 (2013.01); H01S 5/3203 (2013.01); H10H 20/01335 (2025.01); H10H 20/817 (2025.01)] | 10 Claims | 

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               1. An aluminum nitride AlN, aluminum gallium nitride AlGaN, or gallium nitride GaN-based wide bandgap optoelectronic device, comprising: 
            an epitaxial substrate having a two-dimensional 2D material interposer, the epitaxial substrate extending along an epitaxial interface direction, comprising: 
                a polycrystalline base substrate having a superficial layer, a wafer bevel, and a back surface, wherein a difference in coefficient of thermal expansion between the polycrystalline base substrate and AlN or GaN is not greater than 1.5×10−6° C.−1 in a direction parallel to the epitaxial interface; 
                  a multi-orientation 2D ultra-thin material interposer arranged on the superficial layer of the polycrystalline base substrate, wherein the multi-orientation 2D ultra-thin material interposer has a top layer, a lattice constant of the top layer being highly matched with that of AlN, AlGaN, or GaN; and 
                  an AlN, AlGaN, or GaN-based epitaxial layer, which is epitaxially grown on a portion of the multi-orientation 2D ultra-thin material interposer distant from the polycrystalline base substrate, to serve as an active layer; 
                at least a pair of actuating electrodes which actuate the epitaxial substrate; and 
                an encapsulation layer which encapsulates the epitaxial substrate. 
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