US 12,295,180 B2
Semiconductor photomultiplier module comprising a stacked configuration of a sensor chip and electronic readout chips
Razmik Mirzoyan, Unterschleißheim (DE); Masahiro Teshima, Unterschleißheim (DE); David Gascon Fora, Barcelona (ES); Andreu Sanuy Charles, Barcelona (ES); and Sergio Gomez Fernandez, Barcelona (ES)
Assigned to Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V., Munich (DE)
Appl. No. 17/794,719
Filed by Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V., Munich (DE)
PCT Filed Jan. 22, 2021, PCT No. PCT/EP2021/051448
§ 371(c)(1), (2) Date Jul. 22, 2022,
PCT Pub. No. WO2021/148603, PCT Pub. Date Jul. 29, 2021.
Claims priority of application No. 20153057 (EP), filed on Jan. 22, 2020.
Prior Publication US 2023/0084348 A1, Mar. 16, 2023
Int. Cl. H01L 27/146 (2006.01); H04N 25/78 (2023.01); H04N 25/79 (2023.01); H10F 39/00 (2025.01)
CPC H10F 39/809 (2025.01) [H04N 25/78 (2023.01); H04N 25/79 (2023.01); H10F 39/018 (2025.01)] 18 Claims
OG exemplary drawing
 
1. An individually pre-fabricated semiconductor photomultiplier module, comprising:
a first semiconductor chip disposed in a first plane and comprising an array of single-photon sensors;
a second semiconductor chip disposed in a second plane and comprising a first part of an electronic read-out circuit;
a third semiconductor chip disposed in a third plane and comprising a second part of the electronic read-out circuit;
wherein:
the first semiconductor chip, the second semiconductor chip, and the third semiconductor chip are arranged in a stacked relationship and vertical electrical interconnects are arranged to electrically interconnect the first semiconductor chip and the second semiconductor chip, and the second semiconductor chip and the third semiconductor chip; and
mechanical fastening elements configured to laterally connect the individually pre-fabricated semiconductor photomultiplier module with other individually pre-fabricated semiconductor photomultiplier modules.